Surface and subsurface microscopic characteristics in sapphire ultra-precision grinding-Reference-Cited by-同舟云学术

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Surface and subsurface microscopic characteristics in sapphire ultra-precision grinding

Published:2022-10 Issue: Volume:174 Page:107710
ISSN:0301-679X
Container-title:Tribology International
language:en
Short-container-title:Tribology International

Author:

Wang Sheng,Zhao Qingliang,Yang Xiaodong

Funder

National Key Research and Development Program of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference48 articles.

1. Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools;Luo;Tribol Int,2016

2. Sapphire: material, manufacturing, applications;Dobrovinskaya,2009

3. Recent advances in hybrid organic-inorganic materials with spatial architecture for state-of-the-art applications;Al Zoubi;Prog Mater Sci,2020

4. Characterization of fracture toughness and micro-grinding properties of monocrystal sapphire with a multi-layer toughening micro-structure (MTM);Cheng;J Mater Process Technol,2017

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1. The effect of grits interference on materials removal mechanism during scratching process of silicon carbide;Wear;2024-12

2. Subsurface damage in sapphire ultra-precision grinding;Journal of Manufacturing Processes;2024-11

3. Surface micro-morphology model involved in grinding of GaN crystals driven by strain-rate and abrasive coupling effects;International Journal of Machine Tools and Manufacture;2024-10

4. Residual stress and subsurface damage in sapphire ultra-precision grinding;Journal of Materials Processing Technology;2024-07

5. Direct observation of the fracture process on C-plane sapphire by in-situ scratch tests;Journal of Materials Research and Technology;2024-07

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