Stress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materials
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference30 articles.
1. Fracture of functionally graded materials (Editorial);Paulino;Engng. Fract. Mech,2002
2. The crack problems for bonded nonhomogeneous materials under antiplane shear loading;Erdogan;ASME J. Appl. Mech,1985
3. The crack problem in bonded nonhomogeneous materials;Erdogan;ASME J. Appl. Mech,1991
4. The mode III crack problem in bonded materials with a nonhomogeneous interfacial zone;Erdogan;ASME J. Appl. Mech,1991
5. On the mechanical modeling of the interfacial region in bonded half-planes;Delale;ASME J. Appl. Mech,1988
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