Debonding of the interface between a thin film and an orthotropic substrate
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference21 articles.
1. Mixed mode cracking in layered materials;Hutchinson;Adv Appl Mech,1992
2. Thin film cracking and the roles of substrate and interface;Ye;Int J Solids Struct,1992
3. Crack channelling and spalling in a plate due to thermal shock loading;Zhao;J Mech Phys Solids,2000
4. Delamination of thin film strips;Yu;Thin Solid Films,2003
5. Influence of interfacial delamination on channel cracking of elastic thin films;Mei;Int J Fract,2007
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