Thin film cracking and the roles of substrate and interface
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Reference14 articles.
1. Cracking of thin bonded films in residual tension;Beuth;Int. J. Solids Structures,1992
2. Slightly curved or kinked cracks;Cotterell;Int. J. Fract.,1980
3. Experimental observation of substrate fracture caused by residual stressed films;Drory;J. Am. Ceram. Soc.,1990
4. The cracking and decohesion of thin films;Evans;J. Mater. Res.,1988
5. The fracture energy of bimaterial interface;Evans;Mat. Sci. Engng,1990
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