Notch effect on creep–fatigue life for Sn–3.5Ag solder

Author:

Nozaki Mineo,Zhang Shengde,Sakane Masao,Kobayashi Kaoru

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference16 articles.

1. Low cycle fatigue of Sn96 solder with reference to eutectic solder and a high Pb solder;Solomon;ASME J Electron Packag,1991

2. Multiaxial low cycle fatigue of 63Sn–37Pb solder;Yamamoto;J Soc Mater Sci Jpn,1995

3. Low-cycle fatigue behavior of Sn–Ag, Sn–Ag–Cu, and Sn–Ag–Cu–Bi lead-free solders;Kanchanomai;J Electron Mater,2002

4. Multiaxial creep–fatigue of 63Sn–37Pb solder at elevated temperature;Yamamoto;J Soc Mater Sci Jpn,1997

5. Sakane M, Shiratsuchi T, Tsukada Y, Nishimura H. Creep–fatigue damage model for solders. In: Fatigue 2002 proc 8th inter fatigue cong; 2002. p. 3117–24.

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