Effect of processing parameters on fracture toughness of lead-free solder joints

Author:

Nourani Amir,Spelt Jan K.

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference43 articles.

1. Mixed-mode fracture characterization of adhesive joints;Fernlund;Compos Sci Technol,1994

2. Mixed-mode fracture load prediction in lead-free solder joints;Nadimpalli;Engng Fract Mech,2011

3. Fracture load prediction of lead-free solder joints;Nadimpalli;Engng Fract Mech,2010

4. Nourani A, Spelt JK. Intermediate and high strain-rate fracture of lead-free solder joints as a function of mode ratio. In: International conference on soldering and reliability, Toronto, ON, Canada, May 13–15, 2014.

5. Mode mixity effect on the damage of a constrained ductile layer;Varias;J Mech Phys Solids,1992

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