1. Full copper wiring in a sub-0.25 μm CMOS ULSI technology;Edelstein,1997
2. Demonstration of a reliable high-performance and yielding Air gap interconnect process;Yoo,2010
3. Multi-level air gap integration for 32/22 nm nodes using a spin-on thermal degradable polymer and a SiOCCVD hard mask;Daamen,2007
4. “Cost-effective air-gap interconnects by all-in-one post-removing process”;Nakamura,2008
5. The mechanical side of ultra-low k: can it take the strain?;Chandran;Future Fab Int,2004