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Methodology for DIC-based evaluation of the fracture behaviour of solder materials under monotonic and creep loadings

  • Published:2020-11 Issue: Volume:239 Page:107285
  • ISSN:0013-7944
  • Container-title:Engineering Fracture Mechanics
  • language:en
  • Short-container-title:Engineering Fracture Mechanics

Author:

Benabou L.,Nguyen-Van T.A.,Tao Q.B.,Le V.N.,Ould Ouali M.,Nguyen-Xuan H.

Funder

National Foundation for Science and Technology Development

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference42 articles.

1. New Pb-free solder alloy with superior mechanical properties;McCormack;Appl Phys Lett,1993

2. Implementing lead-free electronics;Hwang,2004

3. Mechanical properties of Pb-free SnAg solder joints;Keller;Acta Mater,2011

4. Surface finish effect on reliability of SAC305 soldered chip resistors;Collins;Soldering Surf Mount Technol,2012

5. Thermal fatigue and failure analysis of SnAgCu solder alloys with minor Pb aditions;Collins;IEEE Trans Compon Packag Manuf Technol,2011
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