Author:
Lee J.B.,Lee S.U.,Kim S.S.,Kim B.J.,Kim H.J.,Yoo Y.S.,Kim J.G.,Hong G.W.,Lee H.G.
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mechanical and Electrical Properties of Silver Paste Sintering on Copper-Alloy Slip Rings;Journal of Materials Engineering and Performance;2024-09-04
2. Silver nanoparticles in the thermal silver plating of aluminium busbar joints;Nanotechnology Reviews;2018-09-08
3. Quantitative analysis of peel-off degree for printed electronics;Japanese Journal of Applied Physics;2017-12-28
4. Spray coated nanosilver functional layers;Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2016;2016-09-28
5. Deposition of silver layer on different substrates;Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015;2015-09-11