Effect of the variable profile of substrate conductivity on the dynamics of metal deposition on resistive tape
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
Reference16 articles.
1. Damascene copper electroplating for chip interconnections
2. Galvanoplated 3D structures for micro systems
3. The Theory of the Potential and the Technical Practice of Electrodeposition
4. Transient Behavior during Electrodeposition onto a Metal Strip of High Ohmic Resistance
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Anode Shape on Uniformity of Electrodeposition onto Resistive Substrates;Electrochimica Acta;2017-03
2. Improvement of thickness deposition uniformity in nickel electroforming for micro mold inserts;Journal of Central South University;2016-10
3. Effect of Tool-electrode Shape on Uniformity of Electrochemical Deposition and Dissolution on Resistive Workpieces;Procedia CIRP;2016
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