Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy-Reference-Cited by-同舟云学术

Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy

Published:2016 Issue: Volume:2 Page:2614-2622
ISSN:2452-3216
Container-title:Procedia Structural Integrity
language:en
Short-container-title:Procedia Structural Integrity

Author:

Le V.N.,Benabou L.,Etgens V.,Tao Q.B.

Publisher

Elsevier BV

Subject

General Engineering,Energy Engineering and Power Technology

Reference27 articles.

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4. Beyer, H., Sivasubramaniam, V., Hajas, D., Nanser, E., Brem, F., 2014. Reliability Improvement of Large Area Soldering Connec- tions by Antimony Containing Lead-Free Solder, 1–8.

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