Learning from normalized local and global discriminative information for semi-supervised regression and dimensionality reduction-Reference-Cited by-同舟云学术

Learning from normalized local and global discriminative information for semi-supervised regression and dimensionality reduction

Published:2015-12 Issue: Volume:324 Page:286-309
ISSN:0020-0255
Container-title:Information Sciences
language:en
Short-container-title:Information Sciences

Author:

Zhao Mingbo,Chow Tommy W.S.,Wu Zhou,Zhang Zhao,Li Bing

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Artificial Intelligence,Information Systems and Management,Computer Science Applications,Theoretical Computer Science,Control and Systems Engineering,Software

Reference45 articles.

1. Eigenfaces vs. Fisherfaces: recognition using class specific linear projection;Belhumeur;IEEE Trans. Pattern Anal. Mach. Intell.,1997

2. Manifold regularization: a geometric framework for learning from labeled and unlabeled examples;Belkin;J. Mach. Learn. Res.,2006

3. Semi-supervised discriminant analysis;Cai,2007

4. Introduction to Statistical Pattern Classification;Fukunaga,1990

5. Characterizing virtual eigensignatures for general purpose face recognition in face recognition: from theory to application;Graham;NATO ASI Ser. F, Comput. Syst. Sci.,1998

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sparse semi-supervised multi-label feature selection based on latent representation;Complex & Intelligent Systems;2024-04-17

2. Coordinate Descent Optimized Trace Difference Model for Joint Clustering and Feature Extraction;Pattern Recognition;2024-02

3. RSMS: Robust Semi-supervised Multi-label Feature Selection for Regression;2023 IEEE 35th International Conference on Tools with Artificial Intelligence (ICTAI);2023-11-06

4. Discriminative sparse least square regression for semi-supervised learning;Information Sciences;2023-07

5. Semi-Supervised Deep Kernel Active Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization;Sensors;2023-04-29