A micromechanical model for moisture-induced deterioration in fully biorenewable wood–plastic composites
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Ceramics and Composites
Reference46 articles.
1. Outdoor durability of wood–polymer composites;Stark,2004
2. Wood fiber reinforced bacterial bioplastics composites-fabrication and performance evaluation;Singh;J Compos Sci Technol,2007
3. Polylactide-pine wood flour composites;Pilla;Polym Eng Sci,2008
4. Mechanisms and impact of fiber–matrix compatibilization techniques on the material characterization of PHBV/oak wood flour engineered biobased composites;Srubar;Compos Sci Technol,2012
5. Role of coupling agents on the performance of woodflour–filled polypropylene composites;Maldas;Int J Polym Mater,1994
Cited by 33 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. How to regulate moisture-induced stresses in composites: The answer from nanostructure of S2 layer in Wood cell wall;Composites Part A: Applied Science and Manufacturing;2024-02
2. Moisture Induced Mechanical Characterization of Composite through Numerical Simulation;SAE Technical Paper Series;2023-11-10
3. Effect of moisture absorption-desorption cycles, UV irradiation and coupling agent on the mechanical performance of pinewood waste/polyethylene composites;Clean Technologies and Recycling;2023
4. Using a micromechanical viscoelastic creep model to capture multi-phase deterioration in bio-based wood polymer composites exposed to moisture;Construction and Building Materials;2022-01
5. Additive manufacturing of wood flour/polyhydroxyalkanoates (PHA) fully bio-based composites based on micro-screw extrusion system;Materials & Design;2021-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3