Mo-interlayer-mediated thermal conductance at Cu/diamond interface measured by time-domain thermoreflectance-Reference-Cited by-同舟云学术

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Mo-interlayer-mediated thermal conductance at Cu/diamond interface measured by time-domain thermoreflectance

Published:2020-08 Issue: Volume:135 Page:105921
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Chang Guo,Sun Fangyuan,Wang Luhua,Zhang Yin,Wang Xitao,Wang Jinguo,Kim Moon J.,Zhang Hailong^ORCID

Funder

National Natural Science Foundation of China, China

Youth Science Foundation, China

Louis Beecherl, Jr. Endowment Funds, United States

Global Research and Development Center Program, Korea

Brain Pool Program, Korea

National Research Foundation of Korea, Korea

Ministry of Science and ICT, Korea

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference51 articles.

1. Sarvar F, Whalley DC, Conway PP. Thermal interface materials-a review of the state of the art. In: 1st Electronic Systemintegration Technology Conference, Dresden, vol. 2; 2006. p. 1292–302.

2. Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond;Chang;Acta Mater,2018

3. Thermal conductance of interfaces between highly dissimilar materials;Lyeo;Phys Rev B,2006

4. High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix;Abyzov;J Mater Sci,2011

5. Metals handbook: metallography, structures and phase diagrams;Lyman,1973

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