High thermal conductive silicone rubber composites constructed by strawberry-structured Al2O3-PCPA-Ag hybrids-Reference-Cited by-同舟云学术

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High thermal conductive silicone rubber composites constructed by strawberry-structured Al2O3-PCPA-Ag hybrids

Published:2021-03 Issue: Volume:142 Page:106260
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Yang Dan,Wei Qungui,Li Bingyao,Yu Liyuan,Ni Yufeng,Zhang Liqun

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference48 articles.

1. Lithium doped polyethylene-glycol-based thermal interface pastes for high thermal contact conductance;Luo;J Electron Packag,2002

2. Synergistic improvement of thermal conductivities of polyphenylene sulfide composites filled with boron nitride hybrid fillers;Gu;Compos A,2017

3. Performance improvement in nano-alumina filled silicone rubber composites by using vinyl tri-methoxysilane;He;Polym Test,2018

4. Silicone rubber/hollow silica spheres composites with enhanced mechanical and electrical insulating performances;Li;Mater Lett,2017

5. Improving thermal and mechanical properties of the alumina filled silicone rubber composite by incorporating carbon nanotubes;Lin;New Carbon Mater,2020

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2. Constructing bidirectional heat flow pathways by curved alumina for enhanced thermal conductivity of epoxy composites;Composites Part A: Applied Science and Manufacturing;2024-11

3. Iron Oxide/Magnesium Oxide/Graphene Oxide/Cellulose Composites with Superior Thermal Conductivity, EMI Shielding, and Electrical Insulation Synthesis Using Polydopamine Linker;ACS Applied Polymer Materials;2024-07-30

4. Reduced interfacial thermal resistance in acidic alumina-filled adhesives for heat dissipative applications;Macromolecular Research;2024-06-04

5. A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity;Journal of Polymer Science;2024-03-13

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