Internal oriented strategy of the hBN composite resin with enhanced in-plane or through-plane thermal conductivity via 3D printing
Author:
Funder
Higher Education Discipline Innovation Project
Publisher
Elsevier BV
Subject
Mechanics of Materials,Ceramics and Composites
Reference62 articles.
1. A review of orbital angular momentum vortex waves for the next generation wireless communications;Noor;IEEE Access,2022
2. 5G radio access networks: Enabling efficient point-to-multipoint transmissions;Saily;IEEE Veh Technol Mag,2019
3. An artificial intelligence based-model for heat transfer modeling of 5G smart poles;Khosravi;Case Stud Therm Eng,2021
4. Age-dependence of electromagnetic power and heat deposition in near-surface tissues in emerging 5G bands;Sacco;Sci Rep,2021
5. Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling;Chen;Appl Therm Eng,2022
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Preparation technologies for polymer composites with high-directional thermal conductivity: A review;Nano Research;2024-08-20
2. Polymeric Nanocomposites of Boron Nitride Nanosheets for Enhanced Directional or Isotropic Thermal Transport Performance;Nanomaterials;2024-07-27
3. Thermally conductive, electrically insulating, and radiative cooling PVDF/BNNS/Al2O3/cordierite nanocomposites;Polymer;2024-06
4. Dual-curing polymer systems for photo-curing 3D printing;Additive Manufacturing;2024-04
5. Controllable exfoliation of hexagonal boron nitride and tailored three‐dimensional network for highly thermally conductive polymer composites;Journal of Applied Polymer Science;2023-12-26
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3