Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference29 articles.
1. A novel ultra-thin vapor chamber for heat dissipation in ultra-thin portable electronic devices;Huang;Appl. Therm. Eng.,2020
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4. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review;He;Energy.,2021
5. Heat pipe dryout and temperature hysteresis in response to transient heat pulses exceeding the capillary limit;Baraya;Int. J. Heat Mass Transf.,2020
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