Thermodynamic study and re-assessment of the Ge-Ni system-Reference-Cited by-同舟云学术

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Thermodynamic study and re-assessment of the Ge-Ni system

Published:2012-09 Issue: Volume:38 Page:23-34
ISSN:0364-5916
Container-title:Calphad
language:en
Short-container-title:Calphad

Author:

Jin Shan,Leinenbach Christian,Wang Jiang,Duarte Liliana I.,Delsante Simona,Borzone Gabriella,Scott Andrew,Watson Andrew

Publisher

Elsevier BV

Subject

Computer Science Applications,General Chemical Engineering,General Chemistry

Reference55 articles.

1. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

2. Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates

3. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

4. Metal-germanide Schottky Source/Drain transistor on Germanium substrate for future CMOS technology

5. Thin film reaction of transition metals with germanium

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ni/GeTe Interfacial Reactions and Ni-Ge-Te Phase Equilibria;Journal of Electronic Materials;2023-09-23

2. Development of a Highly Stable Ternary Alloy Catalyst for Dry Reforming of Methane;ACS Catalysis;2023-02-27

3. Presence of έ and ε crystal structures in rapidly solidified intermetallic compound Ni5Ge3;Journal of Alloys and Compounds;2021-12

4. Development of a Novel Ni-Based Multi-principal Element Alloy Filler Metal, Using an Alternative Melting Point Depressant;Metallurgical and Materials Transactions A;2021-04-03

5. Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint;Metals;2020-10-15

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