Author:
Kim Sung-Wng,Kimura Yoshisato,Mishima Yoshinao
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Cited by
126 articles.
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1. Introduction of interstitial Cu atoms is beneficial to improving the thermoelectric performance of TiNiSn;Materials Today Communications;2024-08
2. Exploring the multifaceted properties: structural, electronic, magnetic, mechanical, thermodynamic, transport, and optical characteristics of rhodium-based half-Heusler alloys;Journal of Materials Science;2024-07
3. Electronic, Structural, Thermodynamic, and Mechanical Stabilities, Half-Metallicity, and Thermoelectric Performances of CE-Based Half-Heusler;Journal of Superconductivity and Novel Magnetism;2024-06-26
4. Low lattice thermal conductivity of novel NiVSn with 19 valence electron count contrasted to 18 of NiVAl and NiAlSb Half-Heusler compounds;Journal of Physics and Chemistry of Solids;2024-04
5. Strain dependent electronic structure, phonon and thermoelectric properties of CuLiX (X=S,Te) half Heusler compounds;Physica B: Condensed Matter;2024-03