Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
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1. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
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2. Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens;Metals;2019-12-14
3. DTA Determination of Phase Equilibria in the Ternary Ag-Sb-Sn System;Journal of Phase Equilibria and Diffusion;2018-11-21
4. Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints;Advances in Materials Science and Engineering;2018-05-09
5. Interfacial reactions between Cu and Zn20Sn solder doped with minor RE;Journal of Materials Science: Materials in Electronics;2017-08-07
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