Role of Fe impurities in the nucleation of metastable NiSn4

Author:

Belyakov S.A.,Gourlay C.M.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference38 articles.

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2. Rapid tin-nickel intermetallic growth: some effects on solderability;Harman,1978

3. The growth of intermetallic compounds on common basis materials coated with tin and tin-lead alloys;Kay;Trans Inst Met Finish,1977

4. Intermetallic compound growth in tin and tin-lead platings over nickel and its effects on solderability;Haimovich;Weld J,1989

5. Electromigration effects upon the low-temperature Sn/Ni interfacial reactions;Chen;J Mater Res,2003

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