Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates-Reference-Cited by-同舟云学术

Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates

Published:2012-01 Issue:1 Volume:20 Page:87-92
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Etschmaier Harald,Novák Jiří,Eder Hannes,Hadley Peter

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference30 articles.

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4. Nowottnick M, Wittke K, Scheel W, Pape U. Diffusion Soldering of Heat Exchangers with Reaction Solders, in: IBSC 2000 Conference. Albuquerque, 2000.

5. Possibilities of production of high temperature resistant bonds to non-oxide engineering ceramics using various brazing concepts;Tillmann;Brazing, High Temperature Brazing and Diffusion Welding,1995

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