The effect of a coating on the springback of integrated circuit leadframes
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference7 articles.
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3. D.C. Abbott, D.W. Romm, Palladium plating: a lead free finish for IC leadframes, in: Proceedings of the Electronic Components and Technology Conference, PECCA7, 1995, pp. 1068–1072.
4. Springback in the roller forming of integrated circuit leadframes;Fu;J. Mater. Process. Technol.,1997
5. The grain shape dependence of springback of integrated circuit leadframes;Chan;Mater. Sci. Eng. A,1999
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1. Effects of coating, holding force, stretching height, yield stress, and surface roughness on springback of steel in the V-stretch bending test;Materials Testing;2022-05-01
2. Effect of process parameters on springback behaviour during air bending of electrogalvanised steel sheet;Journal of Zhejiang University-SCIENCE A;2011-03
3. Investigation of Cyclic Elasto-Plastic Behavior of Copper Sheet;Key Engineering Materials;2003-01
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