Nano-precision measurement of diamond tool edge radius for wafer fabrication-Reference-Cited by-同舟云学术

Nano-precision measurement of diamond tool edge radius for wafer fabrication

Published:2003-09 Issue:1-3 Volume:140 Page:358-362
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Li X.P,Rahman M,Liu K,Neo K.S,Chan C.C

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference8 articles.

1. K. Liu, X.P. Li, S.Y. Liang, The mechanism of ductile chip formation in cutting of brittle materials, Trans. ASME, J. Manuf. Sci. Eng., submitted for publication.

2. K. Liu, X.P. Li, M. Rahman, K.S. Neo, C.C. Chan, X.D. Liu, A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers, Trans. ASME, J. Manuf. Sci. Eng., submitted for publication.

3. Measuring the very small cutting-edge radius for a diamond tool using a new kind of SEM having two detectors;Asai;Ann. CIRP,1990

4. Ultra-precision cutting for ZKN7 glass;Fang;Ann. CIRP,2000

5. Effect of tool edge geometry on energy dissipation in ultra-precision machining;Lucca;Ann. CIRP,1997

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