Author:
Tong K.W,Kwong C.K,Ip K.W
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference9 articles.
1. L.T. Nguyen, Reactive flow simulation in transfer molding of IC packages, in: Proceedings of the 43rd Electronic Components and Technology Conference, Piscataway, USA, 1993, pp. 375–390.
2. S. Han, A study on plastic encapsulation of semiconductor chips, Ph.D. Thesis, Cornell University, 1994.
3. S. Han, K.K. Wang, Flow analysis in a cavity with leadframe during semiconductor chip encapsulation, in: Proceedings of the International Electronic Packaging Conference—INTERpack’95, vol. 1, Lahaina, 1995, pp. 73–80.
4. Flow modeling of pqfp during transfer molding;Kuah;J. Electron. Manuf.,1996
5. H.Q. Yang, S.A. Bayyuk, L.T. Nguyen, Time accurate, 3-d computation of wire sweep during plastic encapsulation of IC components, in: Proceedings of the 47th Electronic Components and Technology Conference, 1997, pp. 158–167.
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献