Author:
Seah C.H,Mridha S,Chan L.H
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
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2. B. Luther, et al., VMIC Conf. Proc. 10 (1993) 15.
3. Chemical-mechanical polishing of copper for interconnect formation
Cited by
13 articles.
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