Funder
National Research, Development and Innovation Office
Nemzeti Kutatási Fejlesztési és Innovációs Hivatal
Nemzeti Kutatási, Fejlesztési és Innovaciós Alap
Subject
Fluid Flow and Transfer Processes,Engineering (miscellaneous)
Reference36 articles.
1. Reflow Soldering;Balazs,2020
2. Effect of thermocouple wire size and attachment method on measurement of thermal characteristics of electronic package;Shaukatullah;SAVE Proc.,2003
3. Experimental approach to thermal conductivity of macro solder joints with voids;Sobolewski;Solder. Surf. Mt. Technol.,2019
4. Low-voiding Solder Pastes in LED Assembly;Dziurdzia,2020
5. Real-time profiling of reflow process in VPS chamber;Livovsky;Solder. Surf. Mt. Technol.,2017
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献