Copper nanoparticles promote rapid wound healing in acute full thickness defect via acceleration of skin cell migration, proliferation, and neovascularization-Reference-Cited by-同舟云学术

Copper nanoparticles promote rapid wound healing in acute full thickness defect via acceleration of skin cell migration, proliferation, and neovascularization

Published:2019-10 Issue:4 Volume:517 Page:684-690
ISSN:0006-291X
Container-title:Biochemical and Biophysical Research Communications
language:en
Short-container-title:Biochemical and Biophysical Research Communications

Author:

Alizadeh Sanaz,Seyedalipour Bagher,Shafieyan Saeed,Kheime Abolfazl,Mohammadi Parvaneh^ORCID,Aghdami Nasser

Funder

Royan Institute

Publisher

Elsevier BV

Subject

Cell Biology,Molecular Biology,Biochemistry,Biophysics

Reference26 articles.

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4. Current wound healing procedures and potential care;Dreifke;Mater. Sci. Eng. C,2015

5. Advanced biofabrication strategies for skin regeneration and repair;Pereira;Nanomedicine,2013

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