Metal-metal interfacial bonding: monolayer c(2 × 2) Cu on a Pt(001) surface-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Metal-metal interfacial bonding: monolayer c(2 × 2) Cu on a Pt(001) surface

Published:1991-05 Issue:1 Volume:247 Page:58-68
ISSN:0039-6028
Container-title:Surface Science
language:en
Short-container-title:Surface Science

Author:

Kramar T.,Podloucky R.,Neckel A.,Erschbaumer H.,Freeman A.J.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Reference18 articles.

1. Structure‐property relations for surface processes at the metal/solution interface

2. Proc. Third Symposion on Electrode Processes;McIntyre,1979

3. Copper monolayer formation on platinum single crystal surfaces: Optical and electrochemical studies

4. Surface characterization of Pt electrodes using underpotential deposition of H and Cu

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Quantum–continuum simulation of underpotential deposition at electrified metal–solution interfaces;npj Computational Materials;2017-01-12

2. Modelling of Underpotential Deposition on Bulk Electrodes;Underpotential Deposition;2015-12-15

3. Relevance of Heterometallic Binding Energy for Metal Underpotential Deposition;Langmuir;2001-03-09

4. Cu underpotential deposition on Au(111) and Au(100). Can this be explained in terms of the energetics of the Cu/Au system?;Electrochimica Acta;1999-11

5. An embedded atom approach to underpotential deposition phenomena;Surface Science;1999-02

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3