Structure‐property relations for surface processes at the metal/solution interface
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.574304
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Valency at Electrode Surfaces;Encyclopedia of Surface and Colloid Science, Third Edition;2015-12-04
2. Ab-initio study of the adsorption of Cu on Pt(100);Philosophical Magazine B;1999-02
3. Underpotential Deposition of Lead on Cu(100) in the Presence of Chloride: Ex-Situ Low-Energy Electron Diffraction, Auger Electron Spectroscopy, and Electrochemical Studies;Langmuir;1997-04-01
4. Underpotential Deposition of Lead on Copper(111): A Study Using a Single-Crystal Rotating Ring Disk Electrode and ex Situ Low-Energy Electron Diffraction and Scanning tunneling Microscopy;Langmuir;1995-06
5. Comparison of Cu(111) in aqueous electrolytes and in ultrahigh vacuum: An optical second harmonic generation study;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1992-09
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