Cu6Sn5 intermetallic: Reconciling composition and crystal structure
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference26 articles.
1. Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review
2. Phase Stability, Phase Transformations, and Elastic Properties of Cu6Sn5: Ab initio Calculations and Experimental Results
3. A new phase in stoichiometric Cu6Sn5
4. Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors;Microelectronics Reliability;2024-03
2. Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM;Acta Materialia;2024-01
3. The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics;Electronic Materials Letters;2023-12-12
4. Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents;Journal of Electroanalytical Chemistry;2023-09
5. Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics;Materials Science and Engineering: A;2023-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3