High-strength and high-conductivity Cu-Cu bonding fabricated by resistance micro-welding with amorphous Ni-P coatings and multi-pulse discharging
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
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Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructure evolution and formation mechanism of interfaces in parallel gap resistance welding of stranded Ag-plated Cu conductor to Ag interconnector;Materials & Design;2024-02
2. Effect of Surface Stripes on Electrical-Thermal–Mechanical Behaviors and Interfacial Bonding Formation in Parallel Gap Resistance Welding of Ag Interconnectors;Transactions on Intelligent Welding Manufacturing;2023-12-26
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