Effect of Surface Stripes on Electrical-Thermal–Mechanical Behaviors and Interfacial Bonding Formation in Parallel Gap Resistance Welding of Ag Interconnectors
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Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-99-6136-8_3
Reference26 articles.
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3. Chen N, Wang H, Li J, Liu V, Schroth J (2022) Evolution of Interfacial Microstructure During Resistance Spot Welding of Cu and Al With Ni-P coating. J Manufact Sci Eng 144(4).
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