Atomistic simulation of the mechanical response of a nanoporous body-centered cubic metal-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Atomistic simulation of the mechanical response of a nanoporous body-centered cubic metal

Published:2013-05 Issue:10 Volume:68 Page:817-820
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Ruestes C.J.,Bringa E.M.,Stukowski A.,Rodríguez Nieva J.F.,Bertolino G.,Tang Y.,Meyers M.A.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference41 articles.

1. Size Effects on the Mechanical Behavior of Nanoporous Au

2. Are Nanoporous Materials Radiation Resistant?

3. High Strain Rate Behavior of Refractory Metals and Alloys;Gray,1992

4. Nucleation and growth of voids by radiation

5. Laser compression of monocrystalline tantalum

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cryogenic incipient plasticity in bicrystalline copper with a spherical void and sigma 5 STGB by molecular dynamics simulation;Materials Chemistry and Physics;2024-09

2. Topological changes and deformation mechanisms of nanoporous Ta under compression;Computational Materials Science;2024-03

3. Cryogenic Incipient Plasticity in Bicrystalline Copper with a Spherical Void and Sigma 5 Stgb by Molecular Dynamics Simulation;2024

4. Investigations of void collapse in nanoporous Cu by molecular dynamics simulations;AIP Advances;2023-06-01

5. The low-cyclic fatigue response and its dependence of specific surface area for open-cell nanoporous Cu;Journal of Applied Physics;2023-02-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3