Retarding the Cu5Zn8 phase fracture at the Sn–9wt.% Zn/Cu interface
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference14 articles.
1. Interfacial Reactions between Eutectic SnZn Solder and Bulk or Thin-Film Cu Substrates
2. Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C
3. Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
4. Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads
5. Phase equilibria of the Sn–Zn–Cu ternary system
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