Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys-Reference-Cited by-同舟云学术

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Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Published:2016-10 Issue: Volume:123 Page:113-117
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Kim Gyuseok,Chai Xuzhao,Yu Le,Cheng Xuemei,Gianola Daniel S.

Funder

U.S. Department of Energy

National Science Foundation

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference48 articles.

1. Mechanical properties of nanocrystalline materials

2. Experimental Observations of Stress-Driven Grain Boundary Migration

3. Copper Interconnect Technology;Gupta,2009

4. Thermal stability of on-chip copper interconnect structures

5. Understanding the mechanical behavior of nanocrystalline Al–O thin films with complex microstructures

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1. Decoupling the electrical resistivity contribution of grain boundaries in dilute Fe-alloyed Cu thin films;Scripta Materialia;2023-06

2. Macromagnetic Approach to the Modeling in Time Domain of Magnetic Losses of Ring Cores of Soft Ferrites in Power Electronics;IEEE Transactions on Power Electronics;2023-03

3. Managing mechanical and electrical properties of nanostructured Cu-Fe composite by aging treatment;Materials Characterization;2023-02

4. Combinatorial discovery of irradiation damage tolerant nano-structured W-based alloys;Journal of Nuclear Materials;2022-12

5. Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu;ACS Applied Electronic Materials;2020-07-01

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