Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu-Reference-Cited by-同舟云学术

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Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu

Published:2020-07-01 Issue:7 Volume:2 Page:2049-2056
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Bishara Hanna¹^ORCID,Ghidelli Matteo¹,Dehm Gerhard¹

Affiliation:

1. Max-Planck-Institut für Eisenforschung GmbH, 40237 Düsseldorf, Germany

Funder

H2020 European Research Council

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

http://pubs.acs.org/doi/pdf/10.1021/acsaelm.0c00311

Reference41 articles.

1. The effect of grain boundaries on the electrical resistivity of polycrystalline copper and aluminium

2. Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

3. Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions

4. Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller

5. Grain boundary contribution to the electrical conductivity of polycrystalline Cu films

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