A new densification mechanism of copper powder sintered under an electrical field-Reference-Cited by-同舟云学术

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A new densification mechanism of copper powder sintered under an electrical field

Published:2015-04 Issue: Volume:99 Page:85-88
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Huang Kunlan,Yang Yi,Qin Yi,Yang Gang,Yin Deqiang

Funder

National Nature Science Foundation of China

UK Royal Society/China NSFC International Exchanges Programme

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference27 articles.

1. Micromanufacturing Engineering and Technology;Qin,2010

2. Forming Microgears by Micro-FAST Technology

3. 316 L Stainless Steel Powder Densification during the Coupled Multi-Fields Activated Micro-Forming

4. Densification behavior of copper powder during the coupled multi-physics fields-activated microforming

5. Effects of Heating Rate and Sintering Temperature on 316 L Stainless Steel Powders Sintered Under Multiphysical Field Coupling

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1. Investigation of the Bonding Mechanism of Al Powder Particles through Pulse Current Sintering Technology;Coatings;2024-06-15

2. Fabrication of equiatomic FeCo alloy parts with high magnetic properties by fields activated sintering;Manufacturing Review;2022

3. Influence of discharge plasma modification on physical properties and resultant densification mechanism of spherical titanium powder;Powder Technology;2021-09

4. Ultrasonic Assisted Sintering Using Heat Converted from Mechanical Energy;Metals;2020-07-18

5. Microstructure and densification of the Ti6Al4V–70%TiB2 metal-ceramic by coupled multi-physical fields-activated sintering;Journal of Alloys and Compounds;2020-04

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