Densification behavior of copper powder during the coupled multi-physics fields-activated microforming-Reference-Cited by-同舟云学术

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Densification behavior of copper powder during the coupled multi-physics fields-activated microforming

Published:2013-08-14 Issue:9-12 Volume:69 Page:2651-2657
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Huang Kunlan,Yang Yi,Qin Yi,Yang Gang

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s00170-013-5226-0.pdf

Reference25 articles.

1. Vollertsen F, Niehoff HS, Hu Z (2006) State of the art in microforming. Int J Mach Tool Manu 46:1172–1179. doi: 10.1016/j.ijmachtools.2006.01.033

2. Qin Y (2010) Micro-manufacturing engineering and technology. Elsevier, Oxford

3. Maity KP, Singh RK (2012) An optimisation of micro-EDM operation for fabrication of micro-hole. Int J Adv Manuf Technol 61:1221–1229. doi: 10.1007/s00170-012-4098-z

4. Qin Y, Brockett A, Ma Y, Razali A, Zhao J, Harrison C, Pan W, Dai X, Loziak D (2010) Micro-manufacturing: research, technology outcomes, and development issues. Int J Adv Manuf Technol 47:821–837. doi: 10.1007/s00170-009-2411-2

5. Qin Y (2006) Micro-forming and miniature manufacturing systems development needs and perspectives. J Mater Process Tech 177:8–18. doi: 10.1016/j.jmatprotec.2006.03.212

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