Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference17 articles.
1. Determination of reactive wetting properties of Sn, Sn–Cu, Sn–Ag, and Sn–Pb alloys using a wetting balance technique
2. Lead-free Solders in Microelectronics
3. Dynamics of wetting in reactive metal/ceramic systems: linear spreading
4. MECHANISMS OF REACTIVE WETTING: THE QUESTION OF TRIPLE LINE CONFIGURATION
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