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Diffusion behaviour of Au/Ni bilayers deposited by electron beam evaporation and sputtering onto massive copper substrates

  • Published:1987-05 Issue:3 Volume:28 Page:215-223
  • ISSN:0169-4332
  • Container-title:Applied Surface Science
  • language:en
  • Short-container-title:Applied Surface Science

Author:

Benhenda S.,Guglielmacci J.M.,Gillet M.,Pech T.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Pulse Frequency on Leveling and Resistivity of Copper Coatings;Japanese Journal of Applied Physics;2002-05-15

2. Effect of pulse plating parameters on electrical contact behavior of nickel coatings;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A;1994-06

3. Copper and Zinc Group Elements (Groups 11 and 12);Free Atoms, Clusters, and Nanoscale Particles;1994

4. Interdiffusion and resistivity of Cu/Au, Cu/Co, Co/Au, and Cu/Co/Au thin films at 25–550 °C;Journal of Applied Physics;1990-09

5. Effects of C+implantation on the interdiffusion and resistivity of Cu/Ni/Au thin films;Journal of Applied Physics;1990-05-15
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