Applications of the silicon wafer direct-bonding technique to electron devices-Reference-Cited by-同舟云学术

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Applications of the silicon wafer direct-bonding technique to electron devices

Published:1990-01 Issue: Volume:41-42 Page:627-632
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Furukawa K.,Nakagawa A.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference10 articles.

1. Dielectric isolation of silicon by anodic bonding

2. Wafer bonding for silicon‐on‐insulator technologies

3. Silicon‐to‐silicon direct bonding method

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3. Electrically conducting film of silver sub-micron particles as mechanical and electrical interfaces for transfer printed micro- and nano-pillar devices;Applied Physics A;2013-01-17

4. A Perspective on Nanowire Photodetectors: Current Status, Future Challenges, and Opportunities;IEEE Journal of Selected Topics in Quantum Electronics;2011-07

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