Multichip packaging for very-high-speed digital systems-Reference-Cited by-同舟云学术

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Multichip packaging for very-high-speed digital systems

Published:1990-12 Issue:1-4 Volume:46 Page:121-130
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Bernhardt A.F.,Barfknecht A.T.,Contolini R.J.,Malba V.,Mayer S.T.,Raley N.F.,Tuckerman D.B.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference10 articles.

1. Comparison of Wafer Scale Integration with VLSI Packaging Approaches

2. Flip-chip solder bump fatigue life enhanced by polymer encapsulation

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4. bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages;Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306);1999

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