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Measurements of heat transfer in microchannel heat sinks

  • Published:2000-05 Issue:4 Volume:27 Page:495-506
  • ISSN:0735-1933
  • Container-title:International Communications in Heat and Mass Transfer
  • language:en
  • Short-container-title:International Communications in Heat and Mass Transfer

Author:

Rahman Muhammad Mustafizur

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference12 articles.

1. Heat Transfer Microstructures for Integrated Circuits;Tuckerman,1984

2. Forced-Convection, Liquid-Cooled Microchannel Heat Sinks;Philips,1988

3. Multichip packaging for very-high-speed digital systems

4. Heat Removal from a Silicon Chip Using a Liquid Cooled Microchannel;Wagner,1991

5. Microchannel Fluid Flow in a Silicon Chip;Ulseth,1992

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