Determination of cutting parameters for silicon wafer with a Diamond Wire Saw using an artificial neural network-Reference-Cited by-同舟云学术

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Determination of cutting parameters for silicon wafer with a Diamond Wire Saw using an artificial neural network

Published:2017-06 Issue: Volume:149 Page:285-293
ISSN:0038-092X
Container-title:Solar Energy
language:en
Short-container-title:Solar Energy

Author:

Kayabasi Erhan^ORCID,Ozturk Savas,Celik Erdal,Kurt Huseyin

Funder

Scientific Research Projects Coordination Unit of Karabük University

Electronic Materials Production and Application Center

Publisher

Elsevier BV

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment

Reference29 articles.

1. Artificial neural network development by means of a novel combination of grammatical evolution and genetic algorithm;Ahmadizar;Eng. Appl. Artif. Intell.,2015

2. Automatic ship berthing using artificial neural network trained by consistent teaching data using nonlinear programming method;Ahmed;Eng. Appl. Artif. Intell.,2013

3. Surface roughness prediction model for CNC machining of polypropylene;Allen;Proc. Instit. Mech. Eng., Part B: J. Eng. Manuf.,2008

4. Structured wire: From single wire experiments to multi-crystalline silicon wafer mass production;Anspach;Sol. Energy Mater. Sol. Cells,2014

5. Determining the effect of cutting parameters on surface roughness in hard turning using the Taguchi method;Asiltürk;Measurement,2011

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