1. F. Henley, S. Kang, A. Brailove, A. Fujisaka, Kerf-free wafering for high-volume, high-efficiency c-Si cell, in: Proceedings of the 26th European Photovoltaic Solar Energy Conference, Hamburg, Germany (2011).
2. M. Koitzsch, D. Lewke, F. Kaule, M. Oswald, St. Schönfelder, M. Turek, A. Büchel, H.-U. Zühlke, Thermal Laser Separation – Damage-free and kerfless cutting of wafers and solar cells, Proceedings of 6th International workshop on Crystalline Silicon for Solar Cells, Aix-les-Bains, France (2012).
3. S. Schönfelder, O. Breitenstein, S. Rissland, R. De Donno, J. Bagdahn, Glue-cleave: kerfless wafering for silicon wafers with metal on glueing and removable interface, in: Proceedings of the 22nd Workshop on Crystalline Silicon Solar Cells & Modules: Materials and Processes, Colorado, USA (2012).
4. New crystalline silicon ribbon materials for photovoltacis;Hahn;J. Phys.: Condens. Matter,2004
5. E. Sachs, A. Lorenz, R. Wallace, S. Hudelson, R. Jonczyk, B. Kernan, M. Ismail, D.Harvey, C.L,F. van Mierlo, Direct Wafer™ – High performance 156mm silicon wafers at half the cost of sawn, in: Proceedings of the 28th European Photovoltaic Solar Energy Conference, Paris, France (2013).