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A robust wire crossing design for thermostability and fault tolerance in quantum–dot cellular automata

  • Published:2020-04 Issue: Volume:74 Page:103033
  • ISSN:0141-9331
  • Container-title:Microprocessors and Microsystems
  • language:en
  • Short-container-title:Microprocessors and Microsystems

Author:

Zhang Yongqiang,Xie Guangjun,Han Jie

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Artificial Intelligence,Computer Networks and Communications,Hardware and Architecture,Software

Reference46 articles.

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2. Analytical threshold voltage model for ultrathin SOI MOSFET's including short-channel and floating-body effects;Adan;IEEE Trans. Electron Devices,1999

3. Dynamic behavior of quantum cellular automata;Tougaw;J. Appl. Phys.,1996

4. ToPoliNano: a cad tool for nano magnetic logic;Riente;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2017

5. Bis–ferrocene molecular QCA wire: ab initio simulations of fabrication driven fault tolerance;Pulimeno;IEEE Trans. Nanotechnol.,2013

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3. Design and Implementation of SRAM for LUT and CLB Using Clocking Mechanism in Quantum-Dot Cellular Automata;IEEE Transactions on Circuits and Systems II: Express Briefs;2022-09

4. A new approach to bypass wire crossing problem in QCA nano technology;Circuit World;2021-07-22

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