1. 3D IC design of a fully integrated four-phase buck converter;Chang,2016
2. Floorplanning for 3D-IC with Through-Silicon via co-design using simulated annealing;Zhu,2018
3. 3D-ICs with self-healing capability for thermal effects in RF circuits;Goyal,2014
4. 3DIP: An iterative partitioning tool for monolithic 3D IC;Berhault,2016
5. A 3D IC designs partitioning algorithm with power consideration;Chang,2012