Validation of methodology to determine the contact resistivity of ECA-based bonds grounded on end–contact resistance measurements using redundant and modified TLM test structures-Reference-Cited by-同舟云学术

Validation of methodology to determine the contact resistivity of ECA-based bonds grounded on end–contact resistance measurements using redundant and modified TLM test structures

Published:2023-10 Issue: Volume:262 Page:112518
ISSN:0927-0248
Container-title:Solar Energy Materials and Solar Cells
language:en
Short-container-title:Solar Energy Materials and Solar Cells

Author:

Devoto M. Ignacia^ORCID,Wienands Karl,Rudolph Dominik^ORCID,Timofte Tudor,Halm Andreas,Gottschalg Ralph,Tune Daniel^ORCID

Funder

Bundesministerium für Wirtschaft und Klimaschutz

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Influence of micro– and macrostructure when determining the contact resistivity of interconnects based on electrically conductive adhesives;Devoto Acevedo;Sol. Energy Mater. Sol. Cells,2023

2. How to assess the electrical quality of solar cell interconnection in shingle solar modules;Weber;Prog. Photovoltaics Res. Appl.,2023

3. Metal/semiconductor contact resistivity and its determination from contact resistance measurements;Scorzoni;Mater. Sci. Rep.,1988

4. Electrical modelling of Kelvin structures for the derivation of low specific contact resistivity;Reeves;Eur. Solid-State Device Res. Conf.,1997

5. Kelvin test structure modeling of metal-silicide-silicon contacts;Reeves;MRS Proc,1998

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Structures, electrical properties and catecholase-like activity of a series of new copper(II) coordination polymers supported by azido bridges;Journal of Molecular Structure;2024-12

2. Applying and evaluating a new method to determine the interconnection-induced resistance in shingle solar modules;Solar Energy Materials and Solar Cells;2024-06

3. The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes;Progress in Photovoltaics: Research and Applications;2024-02-12