Preliminary Study on Chemical Figuring and Finishing of Sintered SiC Substrate Using Atmospheric Pressure Plasma
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference13 articles.
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3. Chemical and Mechanical Balance in Polishing of Electronic Materials for Defect-Free Surfaces;Lee;Annals of the CIRP,2009
4. Hybrid Polishing Mechanism of Single Crystal SiC Using Mixed Abrasive Slurry (MAS);Lee;Annals of the CIRP,2010
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